Microwave and millimeter-wave electronic packaging pdf

Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs.

Introduction - Distributed Effects. Thermal Effects. First-Level Interconnects. Second-Level Interconnects. Modules. Conclusions. ; Materials - Electrical Parameters and Their Measurement. Mechanical Parameters. ; Ceramic Packaging - History of Ceramics. Thin-Film Ceramics. Advanced Thin-Film Techniques. Thick-Film Ceramics. Thermally Enhanced Thick-Film Processes. High-Temperature Cofired Ceramic (HTCC). Low-Temperature Cofired Ceramic (LTCC). ; Laminate Packaging - Laminate Board Fabrication. Cost of Laminates. Laminate Circuit Board Tolerances. High-Performance Laminate Materials. Liquid Crystal Polymer. Laminate Multichip Modules. Conclusions. ; First-Level Interconnects - Wire Bond Interconnects. Ribbon Bonding. Flip Chip Interconnects. ; Second-Level Interconnects - Electrical Modeling of Surface-Mount Packages. Inductance and Capacitance Matrix Method for Package Model Extraction. Coupled-π Model Method. Hybrid Circuit Model. ; Modules and Motherboards - Proper Transmission Line Design. Vias for Isolation and Grounding. Cavity Resonances. ; Transitions and 3D Packaging - Transitions Between Transmission Lines. Three-Dimensional Packaging. Conclusions. ; Heat Transfer - Heat Transfer Mechanisms. Amplifier Efficiency and Dissipated Thermal Power. Reliability and Arrhenius Equation. Device Junction Temperature. Junction Temperature with Multiple Material Layers. Thermal Simulations Using Spice. Thermal Simulation Using the Finite Difference Method. Conclusions. ; Electromagnetic Modeling - Quasistatic Simulation of Transmission Lines. Method of Moments. Finite Element Method. Finite Difference Time Domain Method. Mode Matching Technique. Integrated Methods. Domain Decomposition Methods. ; Conclusions and Future Horizons - The 10 Keys to Successful Packaging. Future for Packaging at Microwave Frequencies. Drive for Lower Cost Packaging at Millimeter-Wave.

• Rick Sturdivant

  has 29 years of experience developing phased array systems and components for military and commercial applications. He has authored over 50 articles and conference papers and holds seven issued U.S. patents. He is founder and Chief Technology Officer of Microwave Packaging Technology, Inc which provides products and services for radar and communication systems. Dr. Sturdivant is also an assistant professor at Azusa Pacific University in Azusa, CA where he teaches various courses in engineering.

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Dr. Rick Sturdivant has 29 years of industry experience developing products and services for telecommunications, wireless and military systems. He is a recognized expert in the field of Transmit/Receive (T/R) modules for phased array radar and communication systems. His website is ricksturdivant.com.

Education:

Ph.D. Colorado State University

M.A. Biola University

M.S. Univ. of Calif., Los Angeles

B.S. Calif. State Univ., Long Beach

B.A. Vanguard University

Patents and Articles:

Dr. Sturdivant holds seven U.S. patents and has five pending. He has published 54 journal and conference articles on engineering of systems and components. He has also author several books and book chapters.

Career Summary:

Dr. Sturdivant founded MPT, Inc in 2003 and currently serves as its CTO. MPT provides products and services for phased arrays used in radar and communication systems as well as support components such as beam forming networks, high power amplifiers, low noise amplifiers, up/down converters, and digital receivers. He has taught engineering courses at Azusa Pacific University and Cal Poly Pomona.

He worked at Hughes Aircraft Company and then Raytheon Systems developing radar system components and modules. He designed the world's first radar Tile Array Module for which he was awarded the Engineering Excellence Award by Hughes Aircraft Company. He then worked for Multilink Corporation and helped grow the company to its public offering in 2002. At Multilink, he was instrumental in developing the world's first Ball Grid Array (BGA) modulator driver (Mach-zehnder) at 12.5Gb/S. Since 2003, he has started several successful technology companies that provide products and services in the radio frequency and wireless markets.

Professional Activities:

Dr. Sturdivant regularly presents at conference workshops and other venues. For several years he has been a guest lecturer for a course on T/R Modules for Phased Array Radar at Georgia Tech Research Institute. In addition, he has been an invited speaker to IEEE local chapters such as the local MTT-S chapter in San Diego, CA and the joint MTT-S and AP-S in Baltimore, MD. He has also taught professional development courses in the U.S. and Asia.

Personal:

Rick has been married for 30 years and is the father of a daughter and son. He is an amateur radio operator and enjoys astronomy and fly fishing.